Patent Assignment
Reel/Frame 012763/0019
Assignment of Assignor's Interest
Recorded: 2002-04-02
Pages: 2
Assignors
JEONG, CHANG-OH
Executed: 2002-03-29
KANG, BONG-JOO
Executed: 2002-03-29
LEE, JAE-GAB
Executed: 2002-03-29
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Wiring Line Assembly and Method for Manufacturing the Same, and Thin Film Transistor Array Substrate Having the Wiring Line Assembly and Method for Manufacturing the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.