Patent Assignment
Reel/Frame 012766/0132
To Correct Receiving Party Name
Recorded: 2002-04-03
Received: 2002-04-11
Pages: 3
Assignors
IKEDA, TEKENOBU
Executed: 2001-09-10
YUNOGAMI, TAKASHI
Executed: 2001-09-11
TADOKORO, MASAHIRO
Executed: 2001-09-19
IZAWA, MASARU
Executed: 2001-09-25
Assignee
HITACHI, LTD./NEC CORPORATION
1120, SHIMOKUZAWA, SAGAMIHARA-SHI 229-1134, 6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU, TOKYO/KANAGAWA, JPX, JAPAN
Covered Property
(1)
Method of Manufacturing a Semiconductor Integrated Circuit Device
Application:
09/964,628 →