Patent Assignment
Reel/Frame 012787/0480
Assignment of Assignor's Interest
Recorded: 2002-06-12
Received: 2002-06-12
Pages: 3
Assignee
UNITED MICROELECTRONICS CORP.
SCIENCE-BASED INDUSTRIAL PARK, NO.3, LI-HSIN ROAD 2, HSIN-CHU CITY, TWX, TAIWAN
Covered Properties
(2)
Multi-Die Package
Application:
10/064,110 →
System, Method and Computer Program Product for Global Rendering
Application:
09/954,001 →