Patent Assignment
Reel/Frame 012791/0604
Assignment of Assignor's Interest
Recorded: 2002-04-10
Received: 2002-04-18
Pages: 4
Assignors
APALE, HERMES T.
Executed: 2002-01-14
BALANON, GERRY
Executed: 2002-01-14
SHIM, IL KWON
Executed: 2002-01-14
Assignee
ST ASSEMBLY TEST SERVICES PTE LTD
5 YISHUN STREET 23, SINGAPORE 768442, SGX, SINGAPORE
Covered Property
(1)
Heat Spreader Interconnect Methodology for Thermally Enhanced Pbga Packages
Application:
10/119,920 →