Patent Assignment
Reel/Frame 012806/0478
Assignment of Assignor's Interest
Recorded: 2002-04-15
Received: 2002-04-24
Pages: 2
Assignor
TSUJI, TAKAHARU
Executed: 2001-12-27
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU,, TOKYO 100-8310, JPX, JAPAN
Covered Properties
(2)
Semiconductor Memory Device Capable of Testing Data Line Redundancy Replacement Circuit
Application:
10/121,870 →
Photopolymerizable Epoxy Composition
Application:
09/996,534 →