Patent Assignment
Reel/Frame 012830/0405
Assignment of Assignor's Interest
Recorded: 2002-04-24
Pages: 3
Assignor
LIN, YU WEI
Executed: 2002-02-05
Assignee
VIA TECHNOLOGIES, INC.
8F, NO. 533, CHUNG-CHENG RD., HSIN-TIEN, TAIPEI, R.O.C, TAIWAN
Covered Property
(1)
Electroplating Device, and Process for Electroplating Work Using the Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.