Patent Assignment
Reel/Frame 012839/0798
Assignment of Assignor's Interest
Recorded: 2002-04-18
Pages: 3
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Apparatus and Method for Forming a Combined Substrate Structure
Related Assignments
(7)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Apr 30, 2003
From: NEC CORPORATION
To: NEC LCD TECHNOLOGIES, LTD.
Reel/Frame 014009/0098 →
Change of Name
Nov 8, 2011
From: NEC LCD TECHNOLOGIES, LTD.
To: NLT TECHNOLOGIES, LTD.
Reel/Frame 027188/0890 →
Change of Name
May 15, 2019
From: NLT TECHNOLOGIES, LTD.
To: TIANMA JAPAN, LTD.
Reel/Frame 049188/0536 →
Assignment of Assignor's Interest
May 16, 2019
From: TIANMA JAPAN, LTD.
To: TIANMA MICRO-ELECTRONICS CO., LTD.
Reel/Frame 049203/0605 →
Assignment of Assignor's Interest
Jul 1, 2019
From: TIANMA MICRO-ELECTRONICS CO., LTD.
To: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
Reel/Frame 049644/0278 →
Assignment of Assignor's Interest
Jul 3, 2019
From: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
To: BEIHAI HUIKE PHOTOELECTRIC TECHNOLOGY CO., LTD.
Reel/Frame 049675/0165 →
Corrective Assignment to Correct the Receiving Party Name and Address Previously Recorded at Reel: 49675 Frame: 165. Assignor(S) Hereby Confirms the Assignment.
Sep 11, 2019
From: SHENZHEN TECHVISUM TECHNOLOGIES LIMITED
To: BEIHAI HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
Reel/Frame 050347/0537 →