Patent Assignment
Reel/Frame 012853/0080
Assignment of Assignor's Interest
Recorded: 2002-03-20
Received: 2002-07-01
Pages: 3
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
1006, OAZA KADOMA KADOMA-SHI, OSAKA, JPX, 571-8, JAPAN
Covered Property
(1)
Flip Chip Package, Circuit Board Thereof and Packaging Method Thereof
Application:
10/088,479 →