Patent Assignment
Reel/Frame 012868/0498
Assignment of Assignor's Interest
Recorded: 2002-05-01
Pages: 2
Assignor
U.S. PHILIPS CORPORATION NORTH AMERICA
Executed: 2002-04-13
Assignee
KONINKLIJKE PHILIPS ELECTRONICS N.V.
GROENEWOUDSEWEG 1, 5621 BA EINDHOVEN, NETHERLANDS
Covered Property
(1)
Method of Providing a Vertical Interconnect Between Thin Film Microelectronic Devices
Patent:
6,400,024 →
Application:
09/135,193 →
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 9, 1998
From: DRURY, CHRISTOPHER J.; HART, CORRNELIS M.; MUTSAERS, CORNELIS M.J.; DE LEEUW, DAGOBERT M.
To: U.S. PHILIPS CORPORATION
Reel/Frame 009571/0697 →
Assignment of Assignor's Interest
Jul 28, 2011
From: POLYMER VISION LIMITED
To: CREATOR TECHNOLOGY B.V.
Reel/Frame 026666/0854 →
Assignment of Assignor's Interest
Jul 28, 2011
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: POLYMER VISION LIMITED
Reel/Frame 026667/0219 →
Assignment of Assignor's Interest
Mar 22, 2016
From: CREATOR TECHNOLOGY B.V.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 038214/0991 →