IP Library Assignment 012923/0688
Patent Assignment
Reel/Frame 012923/0688

Assignment of Assignor's Interest

Recorded: 2002-05-21 Received: 2002-05-29 Pages: 3
Assignors
CHOO, DAE-HO
Executed: 2002-05-20
JEON, BAEK-KYUN
Executed: 2002-05-20
NAM, HYUNG-WOO
Executed: 2002-05-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Property (1)
Method and Apparatus for Cutting a Non-Metallic Substrate Using a Laser Beam
Application: 10/150,971 →