Patent Assignment
Reel/Frame 012923/0688
Assignment of Assignor's Interest
Recorded: 2002-05-21
Received: 2002-05-29
Pages: 3
Assignors
CHOO, DAE-HO
Executed: 2002-05-20
JEON, BAEK-KYUN
Executed: 2002-05-20
NAM, HYUNG-WOO
Executed: 2002-05-20
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Cutting a Non-Metallic Substrate Using a Laser Beam
Application:
10/150,971 →