Patent Assignment
Reel/Frame 012956/0342
Assignment of Assignor's Interest
Recorded: 2002-06-05
Received: 2002-06-10
Pages: 8
Assignors
PENDSE, RAJENDRA
Executed: 2002-04-11
TAM, SAMUEL
Executed: 2002-04-11
AHMAD, NAZIR
Executed: 2002-04-17
CHEN, ANDREA
Executed: 2002-04-28
KIM, KYUNG-MOON
Executed: 2002-05-07
KWEON, YOUNG DO
Executed: 2002-05-21
Assignee
CHIPPAC, INC.
47400 KATO ROAD, FREMONT, CA, 94538, UNITED STATES
Covered Property
(1)
Chip Scale Package with Flip Chip Interconnect
Application:
10/081,491 →