IP Library Assignment 012978/0386
Patent Assignment
Reel/Frame 012978/0386

Assignment of Assignor's Interest

Recorded: 2002-06-05 Pages: 6
Assignors
TRAN, DEAN
Executed: 2002-05-30
AKBANY, SALIM
Executed: 2002-06-04
LOWERY, MAURICE
Executed: 2002-05-31
SINGLETON, JR., LEON M.
Executed: 2002-06-03
DEPACE, RONALD A.
Executed: 2002-05-31
Assignee
TRW INC.
ONE SPACE PARK, E2/6051, SPACE & ELECTRONICS, REDONDO BEACH, CALIFORNIA, 90278
Covered Property (1)
Thermal Solder Writing Eutectic Bonding Process and Apparatus
Patent: 6,945,447 →
Application: 10/162,973 →
Publication: US 2003/0226877
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 12, 2003
From: TRW, INC. N/K/A NORTHROP GRUMMAN SPACE AND MISSION SYSTEMS CORPORATION, AN OHIO CORPORATION
To: NORTHROP GRUMMAN CORPORATION
Reel/Frame 013751/0849 →
Assignment of Assignor's Interest Nov 30, 2009
From: NORTHROP GRUMMAN CORPORTION
To: NORTHROP GRUMMAN SPACE & MISSION SYSTEMS CORP.
Reel/Frame 023699/0551 →
Assignment of Assignor's Interest Feb 10, 2010
From: NORTHROP GRUMMAN SPACE & MISSION SYSTEMS CORP.
To: NORTHROP GRUMMAN SYSTEMS CORPORATION
Reel/Frame 023915/0446 →