Patent Assignment
Reel/Frame 012990/0718
Assignment of Assignor's Interest
Recorded: 2002-06-11
Received: 2002-06-19
Pages: 3
Assignee
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
KADOMA-SHI, 1006 OAZA KADOMA, OSAKA 571-8501, JPX, JAPAN
Covered Property
(1)
Resin-Sealed Semiconductor Device and Manufacturing Method Thereof
Application:
10/166,246 →