Patent Assignment
Reel/Frame 012992/0542
Assignment of Assignor's Interest
Recorded: 2002-06-05
Received: 2002-06-19
Pages: 4
Assignee
LATTICE SEMICONDUCTOR CORPORATION
555 N.E. MOORE COURT, HILLSBORO, OR, 97124, UNITED STATES
Covered Property
(1)
Semiconductor Device Having Metallized Interconnect Structure and Method of Fabrication
Application:
10/164,484 →