Assignment of Assignor's Interest

Recorded: 2002-06-21 Received: 2002-07-02 Pages: 2

Assignors

CHOO, DAE-HO

Executed: 2002-06-17

JEON, BAEK-KYUN

Executed: 2002-06-17

NAM, HYUNG-WOO

Executed: 2002-06-18

Assignee

SAMSUNG ELECTRONICS CO., LTD.

416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGGI-DO, KRX, KOREA, REPUBLIC OF

Covered Property (1)

Method and Apparatus for Cutting a Substrate into Multiple Pieces with a Single Irradiation of a Laser Beam

Application: 10/176,041 →