IP Library Assignment 013043/0226
Patent Assignment
Reel/Frame 013043/0226

Assignment of Assignor's Interest

Recorded: 2002-06-25 Pages: 4
Assignors
MATSUO, YOSHIHIKO
Executed: 2002-05-29
IKEDA, RYUKICHI
Executed: 2002-05-31
YOSHIDA, KIMIHIKO
Executed: 2002-05-31
OKUDA, FUMIO
Executed: 2002-05-31
Assignees
SHARP KABUSHIKI KAISHA
ABENO-KU, OSAKA-SHI, 22-22 NAGAIKE-CHO, OSAKA, 545-8, JAPAN
LEADMIKK, LTD.
MOJI-KU, KITA KYUSHU-SHI, 2-2-1 KOMORIE, FUKUOKA, 800-0, JAPAN
Covered Property (1)
Method for Forming Plating Film and Electronic Component Having Plating Film Formed Thereon by Same Method
Patent: 6,811,672 →
Application: 10/178,304 →
Publication: US 2003/0003320
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Feb 14, 2005
From: LEADMIKK, LTD.
To: KOBE LEADMIKK CO., LTD.
Reel/Frame 016263/0013 →