Patent Assignment
Reel/Frame 013100/0609
Assignment of Assignor's Interest
Recorded: 2002-07-18
Received: 2002-07-23
Pages: 2
Assignor
CHO, YOUNG-A
Executed: 2002-05-30
Assignee
HYNIX SEMICONDUCTOR INC.
BUBAL-EUP, ICHEON-SHI, SAN 136-1, AMI-RI, GYUNGGI-DO, KRX, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Forming Wire in Semiconductor Device
Application:
10/116,941 →