Patent Assignment
Reel/Frame 013102/0719
Assignment of Assignor's Interest
Recorded: 2002-07-16
Received: 2002-07-24
Pages: 3
Assignees
HITACHI, LTD.
4-CHOME, 6, KANDA SURUGADAI, CHIYODA-KU, TOKYO, JPX, JAPAN
HITACHI HOKKAI SEMICONDUCTOR, LTD.
KAMEDA-GUN, 145, AZANAKAJIMA, NANAECHO, HOKKAIDO, JPX, JAPAN
Covered Properties
(3)
A Method of Manufacturing a Semiconductor Device in Which a Block Molding Package Utilizes Air Vents in a Substrate
Application:
10/195,084 →
Facilitating Efficient Join Operations Between a Head Thread and a Speculative Thread
Application:
10/194,911 →
Data Encryption and Decryption
Application:
10/193,568 →