Patent Assignment
Reel/Frame 013114/0209
Assignment of Assignor's Interest
Recorded: 2002-07-11
Received: 2002-07-26
Pages: 9
Assignors
FARNWORTH, WARREN M.
Executed: 2002-06-07
HIATT, WILLIAM MARK
Executed: 2002-06-14
SINHA, NISHANT
Executed: 2002-06-18
WATKINS, CHARLES
Executed: 2002-06-18
Assignee
MICRON TECHNOLOGY, INC.
LEGAL DEPARTMENT, M/S 525, 8000 SOUTH FEDERAL WAY, BOISE, ID, 83706, UNITED STATES
Covered Property
(1)
Method of fabricating semiconductor component having encapsulated, bonded, interconnect contacts
Application:
10/193,567 →