Patent Assignment
Reel/Frame 013115/0427
Assignment of Assignor's Interest
Recorded: 2002-07-15
Pages: 2
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, PALDAL-KU, SUWON-CITY, KYUNGKI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multi-Chip Package (Mcp) with Spacer