Patent Assignment
Reel/Frame 013132/0437
Assignment of Assignor's Interest
Recorded: 2002-06-26
Received: 2002-09-30
Pages: 2
Assignors
ASANO, ISAMU
Executed: 2001-07-02
IWASAKI, TOMIO
Executed: 2001-07-02
MIURA, HIDEO
Executed: 2001-07-02
Assignee
HITACHI, LTD.
CHIYODA-KU, 6 KANDA SURUGADAI 4-CHOME, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device with Multilayer Conductive Structure Formed on a Semiconductor Substrate
Application:
09/787,528 →