Patent Assignment
Reel/Frame 013139/0521
Assignment of Assignor's Interest
Recorded: 2002-10-01
Pages: 3
Assignee
SEIKO EPSON CORPORATION
SHINJUKU-KU, 4-1 NISHI-SHINJUKU 2-CHOME, TOKYO, JAPAN
Covered Property
(1)
Transfer Method, Method of Manufacturing Thin Film Devices, Method of Manufacturing Integrated Circuits, Circuit Board and Manufacturing Method Thereof, Electro-Optical Apparatus and Manufacturing Method Thereof, Ic Card, and Elecronic Appliance
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.