IP Library › Assignment 013158/0901
Patent Assignment
Reel/Frame 013158/0901

Security Agreement

Recorded: 2002-08-26 Received: 2002-08-26 Pages: 13
Assignor
Assignee
LASALLE BUSINESS CREDIT, INC., AS AGENT
135 S. LASALLE STREET, SUITE 425, CHICAGO, IL, 60603, UNITED STATES
Covered Properties (7)
Fluid-Cooled Heat Sink for Electronic Components
Application: 10/121,337 →
Heat Sink for Electronic Components
Application: 10/121,177 →
Heat collector with mounting plate
Application: 60/328,330 →
Heat sink
Application: 09/939,356 →
Heat Sink Having Bonded Cooling Fins
Application: 09/859,715 →
Channel connection for pipe to block joints
Application: 09/848,016 →
Notched finned heat sink structure
Application: 09/835,897 →