Patent Assignment
Reel/Frame 013198/0025
Change of Name
Recorded: 2002-08-19
Received: 2002-08-21
Pages: 5
Assignor
SAMPO SEMICONDUCTOR CORPORATION
Executed: 2001-11-28
Assignee
AMKOR TECHNOLOGY TAIWAN (LUNG TAN) LTD.
15/F, 168 TUN HUA N. RD., TAIPEI, TWX, ROC, TAIWAN
Covered Property
(1)
Apparatus for packing semiconductor die
Application:
09/940,736 →