Patent Assignment
Reel/Frame 013226/0197
Assignment of Assignor's Interest
Recorded: 2002-08-19
Received: 2002-08-29
Pages: 2
Assignor
SHIBATA, JUN
Executed: 2002-07-23
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Property
(1)
Semiconductor Device Having Semiconductor Element Packaged on Interposer
Application:
10/222,841 →