Assignment of Assignor's Interest

Recorded: 2002-09-05 Received: 2002-09-11 Pages: 2

Assignor

KIM, SUNG KON

Executed: 2002-08-29

Assignee

LG.PHILIPS LCD CO., LTD.

20, YOIDO-DONG, YOUNGDUNGPO-GU, SEOUL, KRX, KOREA, REPUBLIC OF

Covered Properties (2)

Method and Apparatus of Sealing Wafer Backside for Full-Face Electrochemical Plating

Application: 10/159,295 →

Flat Display Module-Housing Assembly

Application: 10/028,701 →