IP Library › Assignment 013274/0970
Patent Assignment
Reel/Frame 013274/0970

Assignment of Assignor's Interest

Recorded: 2002-09-09 Pages: 2
Assignor
TSUCHIYAMA, YUJI
Executed: 2002-08-21
Assignee
UNISIA JECS CORPORATION
1370, ONNA, ATSUGI-SHI, KANAGAWA 243-8510, JAPAN
Covered Property (1)
Spacer for Mounting a Chip Package to a Substrate
Patent: 7,119,430 →
Application: 10/237,083 →
Publication: US 2003/0056965
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Feb 11, 2005
From: HITACHI UNISIA AUTOMOTIVE, LTD.
To: HITACHI, LTD.
Reel/Frame 016245/0106 →
Change of Name Feb 11, 2005
From: UNISIA JECS CORPORATION
To: HITACHI UNISIA AUTOMOTIVE, LTD.
Reel/Frame 016245/0964 →