Patent Assignment
Reel/Frame 013275/0655
Assignment of Assignor's Interest
Recorded: 2002-09-10
Received: 2002-09-16
Pages: 2
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16, CREATION RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSIN CHU, TWX, R.O.C., TAIWAN
Covered Property
(1)
Method of Forming Shallow Trench Isolation in a Semiconductor Substrate
Application:
10/237,693 →