IP Library › Assignment 013301/0570
Patent Assignment
Reel/Frame 013301/0570

Assignment of Assignor's Interest

Recorded: 2002-09-23 Pages: 8
Assignor
CHOI, KANG RIM
Executed: 2002-03-11
Assignee
IXYS CORPORATION
3540 BASSETT STREET, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Power Device with a Plastic Molded Package and Direct Bonded Substrate
Patent: 6,727,585 →
Application: 10/099,061 →
Publication: US 2002/0163074
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 13, 2002
From: CHOI, KANG RIM
To: IXYS CORPORATION
Reel/Frame 012722/0620 →
Merger and Change of Name Mar 31, 2018
From: IXYS CORPORATION; IXYS, LLC
To: IXYS, LLC
Reel/Frame 045406/0588 →
Assignment of Assignor's Interest May 1, 2019
From: IXYS, LLC
To: LITTELFUSE, INC.
Reel/Frame 049056/0649 →