Patent Assignment
Reel/Frame 013301/0928
Correction to Assignment Previously Recorded on Reel/Frame 012948/0294; Equal, Undivided, Part Interest, Right and Title to Siemens Ag.
Recorded: 2002-09-17
Received: 2002-09-19
Pages: 3
Assignor
EFEN GMBH
Executed: 2002-03-23
Assignee
SIEMENS AG
WITTELSBACHER PLATZ 2, MUNICH, DEX, 80333, GERMANY
Covered Properties
(2)
Substrate Etch Method and Device
Application:
10/178,033 →
Current Distributor
Application:
09/886,785 →