Patent Assignment
Reel/Frame 013304/0856
Assignment of Assignor's Interest
Recorded: 2002-09-16
Received: 2002-09-24
Pages: 3
Assignors
SATO, HIROTOSHI
Executed: 2002-07-29
TAKATSUKA, TAKAFUMI
Executed: 2002-07-29
TSUKUDE, MASAMKI
Executed: 2002-07-29
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Properties
(3)
Thermal Mismatch Compensation Technique for Integrated Circuit Assemblies
Application:
10/310,230 →
Semiconductor Memory Device
Application:
10/244,026 →
Method for Carrying Out Radical Ethylene High-Pressure Polymerization While Preventing Undesired Polymer Deposits
Application:
10/182,563 →