Patent Assignment
Reel/Frame 013322/0971
Assignment of Assignor's Interest
Recorded: 2002-09-19
Received: 2002-09-27
Pages: 3
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO,, JPX, JAPAN
Covered Property
(1)
Bonding Tool Capable of Bonding Inner Leads of Tab Tapes to Electrode Pads in High Quality and High Productivity and Bonding Method
Application:
10/179,907 →