Patent Assignment
Reel/Frame 013324/0167
Assignment of Assignor's Interest
Recorded: 2002-06-25
Received: 2002-09-27
Pages: 4
Assignors
ROGLER, WOLFGANG
Executed: 2002-02-25
ROTH, WOLFGANG
Executed: 2002-02-25
BAYER, HEINER
Executed: 2002-03-25
Assignee
SIEMENS AKTIENGESELLSCHAFT
WITTELSBACHERPLATZ 2, D-80333, MUNICH, DEX, GERMANY
Covered Property
(1)
Method for Encapsulating Components
Application:
10/070,608 →