IP Library › Assignment 013327/0218
Patent Assignment
Reel/Frame 013327/0218

Assignment of Assignor's Interest

Recorded: 2002-09-25 Received: 2002-09-30 Pages: 3
Assignors
LODDENKOTTER, MANFRED
Executed: 2002-03-18
STOLZE, THILO
Executed: 2002-03-19
Assignee
EUPEC EUROPAEISHCHE GESELLSCHAFT F. LEISTUNGSHALBLEITER MBH+CO.KG
MAX-PLANCK-STR.5, WARSTEIN-BELECKE, DEX, 59581, GERMANY
Covered Property (1)
Connecting Device for Power Semiconductor Modules with Compensation for Mechanical Stresses
Application: 09/793,793 →