Patent Assignment
Reel/Frame 013375/0031
Assignment of Assignor's Interest
Recorded: 2002-10-02
Received: 2002-10-16
Pages: 2
Assignors
BRANDENBURG, SCOTT D.
Executed: 2002-08-23
CARTER, BRADLEY H.
Executed: 2002-08-23
STEPNIAK, FRANK
Executed: 2002-08-23
YEH, SHING
Executed: 2002-08-23
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE : 480-410-202, P.O. BOX 5052, TROY, MI, UNITED STATES
Covered Properties
(3)
High Speed Oc-768 Configurable Link Layer Chip
Application:
10/266,232 →
Bent Gate Transistor Modeling
Application:
10/265,803 →
Lead-Based Solder Alloys Containing Copper
Application:
10/226,370 →