IP Library Assignment 013375/0031
Patent Assignment
Reel/Frame 013375/0031

Assignment of Assignor's Interest

Recorded: 2002-10-02 Received: 2002-10-16 Pages: 2
Assignors
BRANDENBURG, SCOTT D.
Executed: 2002-08-23
CARTER, BRADLEY H.
Executed: 2002-08-23
STEPNIAK, FRANK
Executed: 2002-08-23
YEH, SHING
Executed: 2002-08-23
Assignee
DELPHI TECHNOLOGIES, INC.
LEGAL STAFF - MAIL CODE : 480-410-202, P.O. BOX 5052, TROY, MI, UNITED STATES
Covered Properties (3)
High Speed Oc-768 Configurable Link Layer Chip
Application: 10/266,232 →
Bent Gate Transistor Modeling
Application: 10/265,803 →
Lead-Based Solder Alloys Containing Copper
Application: 10/226,370 →