Patent Assignment
Reel/Frame 013407/0307
Assignment of Assignor's Interest
Recorded: 2002-10-09
Received: 2002-10-25
Pages: 3
Assignor
FAY, OWEN
Executed: 2002-10-08
Assignee
MOTOROLA, INC.
1303 EAST ALGONQUIN ROAD, LAW DEPARTMENT, SCHAUMBURG, IL, 60196, UNITED STATES
Covered Property
(1)
Method for Eliminating Voiding in Plated Solder
Application:
10/267,453 →