Patent Assignment
Reel/Frame 013420/0206
Re-Record to Correct Assignor Name Previously Recorded at Reel/Frame 012536/0995.
Recorded: 2002-10-25
Received: 2002-10-30
Pages: 3
Assignors
LIN, WEI-FENG
Executed: 1999-11-23
TSAI, CHEN-WEN
Executed: 1999-11-23
WU, CHUNG-JU
Executed: 1999-11-23
Assignee
SILICON INTEGRATED SYSTEMS CORP.
NO. 16, CREATION RD. 1, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TWX, TAIWAN
Covered Property
(1)
Bond Pad Structure and Its Method of Fabricating
Application:
10/056,004 →