Patent Assignment
Reel/Frame 013440/0183
Assignment of Assignor's Interest
Recorded: 2002-10-30
Pages: 2
Assignor
NEC CORPORATION
Executed: 2002-10-01
Assignee
NEC TOPPAN CIRCUIT SOLUTIONS, INC.
2-2-7, YEASU, CHUO-KU, TOKYO, 104-0028, JAPAN
Covered Property
(1)
Method of manufacturing laminate and grommet used for the method
Application:
10/187,964 →
Publication:
US 2002/0176950