Patent Assignment
Reel/Frame 013442/0463
Assignment of Assignor's Interest
Recorded: 2002-10-29
Pages: 3
Assignors
KIM, DONG-KUK
Executed: 2002-08-13
JEONG, SEUNG-BAE
Executed: 2002-08-13
JEONG, KI-KWON
Executed: 2002-08-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
SAN 16, BANWOI, RI, TAEAN-EUB, HWASUNG-CITY, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Apparatus and Method for Wafer Backside Inspection