Patent Assignment
Reel/Frame 013485/0227
Assignment of Assignor's Interest
Recorded: 2002-10-24
Received: 2002-11-19
Pages: 2
Assignor
MAEDA, ATSUSHI
Executed: 2002-08-28
Assignee
MITSUBISHI DENKI KABUSHIKI KAISHA
2-3, MARUNOUCHI 2-CHOME,, CHIYODA-KU, TOKYO 100-8310, JPX, JAPAN
Covered Properties
(2)
Micropattern Shape Measuring System and Method
Application:
10/291,675 →
Semiconductor Device with Solid State Image Pickup Element
Application:
10/278,906 →