Patent Assignment
Reel/Frame 013498/0724
Assignment of Assignor's Interest
Recorded: 2002-11-15
Pages: 2
Assignee
FAIRCHILD KOREA SEMICONDUCTOR LTD.
82-3, DODANG-DONG, WONMI-KU, BUCHEON CITY, KYONGGI-DO 420-711, KOREA, REPUBLIC OF
Covered Property
(1)
Wafer-Level Chip Scale Package Having Stud Bump and Method for Fabricating the Same
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 2, 2017
From: FAIRCHILD KOREA SEMICONDUCTOR, LTD.
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 044361/0205 →
Patent Security Agreement
Jul 11, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046530/0460 →
Release of Security Interest in Patents Recorded at Reel 046530, Frame 0460
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064075/0001 →