Patent Assignment
Reel/Frame 013501/0982
Assignment of Assignor's Interest
Recorded: 2002-11-19
Received: 2002-11-22
Pages: 3
Assignor
NEC CORPORATION
Executed: 2002-10-16
Assignee
NEC COMPOUND SEMICONDUCTOR DEVICES LTD.
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA 211-8666, JPX, JAPAN
Covered Properties
(5)
Method of Manufacturing a Plural Unit High Frequency Transistor
Application:
09/973,717 →
Semiconductor Device with an Improved Bonding Pad Structure and Method of Bonding Bonding Wires to Bonding Pads
Application:
09/942,729 →
Lead Frame, Semiconductor Device Produced by Using the Same and Method of Producing the Semiconductor Device
Application:
09/923,394 →
Lead-less semiconductor device with improved electrode pattern structure
Application:
09/840,141 →
Phase capacitor, and phase locked loop circuit having the same as well as method of phase comparison
Application:
09/826,353 →