Patent Assignment
Reel/Frame 013519/0157
Assignment of Assignor's Interest
Recorded: 2002-11-20
Pages: 2
Assignee
SUN MICROSYSTEMS, INC.
4150 NETWORK CIRCLE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method and Apparatus for Establishment of a Die Connection Bump Layout
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.