Patent Assignment
Reel/Frame 013524/0526
Assignment of Assignor's Interest
Recorded: 2002-11-22
Pages: 3
Assignor
JEON, BAEK-KYUN
Executed: 2002-11-11
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416 MAETAN-DONG, PALDAL-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Method and Apparatus for Cutting Nonmetallic Substrate
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.