Patent Assignment
Reel/Frame 013562/0035
Assignment of Assignor's Interest
Recorded: 2002-12-05
Received: 2002-12-13
Pages: 2
Assignor
TSAI, CHUNG-CHE
Executed: 2002-10-18
Assignee
ULTRATERA CORPORATION
NO. 2 LI-HSIN ROAD, 3, SCIENCE-BASED INDUSTRIAL PARK, HSINCHU, TWX, R.O.C., TAIWAN
Covered Properties
(2)
Stacked Multi-Chip Semiconductor Package and Fabrication Method Thereof
Application:
10/314,064 →
Apparatus and Method for Deposition of an Electrophoretic Emulsion
Application:
10/234,982 →