Patent Assignment
Reel/Frame 013574/0831
Assignment of Assignor's Interest
Recorded: 2003-04-14
Pages: 2
Assignor
HUI KEK, THENG
Executed: 2003-04-14
Assignee
AGILENT TECHNOLOGIES, INC.
P.O. BOX 7599, LEGAL DEPARTMENT, DL429, INTELLECTUAL PROPERTY ADMINISTRATION, LOVELAND, COLORADO, 80537-0599
Covered Property
(1)
Lead Frame Wire Bonding Clamp Member
Related Assignments
(6)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Feb 22, 2006
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP PTE. LTD.
Reel/Frame 017207/0020 →
Security Agreement
Feb 24, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: CITICORP NORTH AMERICA, INC.
Reel/Frame 017207/0882 →
Assignment of Assignor's Interest
May 25, 2006
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
Reel/Frame 017675/0518 →
Merger
May 7, 2013
From: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030369/0528 →
Release of Security Interest
May 15, 2013
From: CITICORP NORTH AMERICA, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 030422/0021 →
Corrective Assignment to Correct the Name of the Assignee Previously Recorded on Reel 017207 Frame 0020. Assignor(S) Hereby Confirms the Assignment.
May 6, 2016
From: AGILENT TECHNOLOGIES, INC.
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 038633/0001 →