Patent Assignment
Reel/Frame 013591/0888
Assignment of Assignor's Interest
Recorded: 2002-12-16
Received: 2002-12-23
Pages: 2
Assignor
INTEGRATED ELECTRONICS & PACKAGING TECHNOLOGIES
Executed: 2002-10-11
Assignee
CASIO COMPUTER CO., LTD.
6-2, HON-MACHI 1-CHOME, SHIBUYA-KU, TOKYO, JPX, JAPAN
Covered Property
(1)
Semiconductor Device and Method of Manufacturing the Same
Application:
09/858,230 →