Assignment of Assignor's Interest

Recorded: 2002-12-18 Received: 2002-12-26 Pages: 3

Assignor

PARK, CHEOL SOO

Executed: 2002-11-25

Assignee

DONGBU ELECTRONICS CO., LTD.

891-10, DAECHI-DONG, KANGNAM-GU, SEOUL, KRX, KOREA, REPUBLIC OF

Covered Properties (2)

Die Frame Apparatus and Method of Transferring Dies Therewith

Application: 10/322,701 →

Method for Forming Isolation Layer in Semiconductor Device

Application: 10/322,849 →