Assignment of Assignor's Interest

Recorded: 2003-01-06 Received: 2003-01-10 Pages: 4

Assignors

LEWENTZ, GUNTER

Executed: 2002-10-02

PERRAS, ALWIN

Executed: 2002-10-02

VOIGT, ANDREAS

Executed: 2002-10-02

ENKE, OLAF

Executed: 2002-10-18

YANCIN, HAKAN

Executed: 2002-11-28

Assignee

SIEMENS AKTIENGESELLSCHAFT

WITTELSBACHERPLATZ 2, 80333 MUNCHEN, DEX, GERMANY

Covered Properties (2)

Method for manufacturing a semiconductor device and a resin sealing device therefor

Application: 10/321,650 →

Injection Valve Comprising an Optimized Surface Geometry Between a Nozzle Body and a Retaining Nut

Application: 10/271,240 →