Patent Assignment
Reel/Frame 013651/0959
Assignment of Assignor's Interest
Recorded: 2003-01-14
Received: 2003-01-16
Pages: 4
Assignors
BOMBONATI, MAURO
Executed: 2003-01-02
MARCHI, MAURO
Executed: 2003-01-02
MASTROMATTEO, UBALDO
Executed: 2003-01-02
MORIN, DANIELA
Executed: 2003-01-02
MOTTURA, MARTA
Executed: 2003-01-02
Assignee
STMICROELECTRONICS S.R.L.
VIA C. OLIVETTI, 2, I-20041 AGRATE BRIANZA, ITX, ITALY
Covered Property
(1)
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
Application:
10/243,972 →